JPS628403A - 車輛用灯具 - Google Patents

車輛用灯具

Info

Publication number
JPS628403A
JPS628403A JP60145741A JP14574185A JPS628403A JP S628403 A JPS628403 A JP S628403A JP 60145741 A JP60145741 A JP 60145741A JP 14574185 A JP14574185 A JP 14574185A JP S628403 A JPS628403 A JP S628403A
Authority
JP
Japan
Prior art keywords
light emitting
socket
heat
emitting diode
heat sink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60145741A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0544761B2 (en]
Inventor
芹沢　啓之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Priority to JP60145741A priority Critical patent/JPS628403A/ja
Publication of JPS628403A publication Critical patent/JPS628403A/ja
Publication of JPH0544761B2 publication Critical patent/JPH0544761B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
JP60145741A 1985-07-04 1985-07-04 車輛用灯具 Granted JPS628403A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60145741A JPS628403A (ja) 1985-07-04 1985-07-04 車輛用灯具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60145741A JPS628403A (ja) 1985-07-04 1985-07-04 車輛用灯具

Publications (2)

Publication Number Publication Date
JPS628403A true JPS628403A (ja) 1987-01-16
JPH0544761B2 JPH0544761B2 (en]) 1993-07-07

Family

ID=15392072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60145741A Granted JPS628403A (ja) 1985-07-04 1985-07-04 車輛用灯具

Country Status (1)

Country Link
JP (1) JPS628403A (en])

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0386506U (en]) * 1989-12-20 1991-09-02
JP2005114924A (ja) * 2003-10-06 2005-04-28 Pentax Corp 撮影用照明装置
WO2007099796A1 (ja) * 2006-02-22 2007-09-07 Nippon Sheet Glass Company, Limited. 発光ユニット、照明装置及び画像読取装置
US7344296B2 (en) 2003-02-07 2008-03-18 Matsushita Electric Industrial Co., Ltd. Socket for led light source and lighting system using the socket

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092852U (ja) * 1983-11-30 1985-06-25 白光電器工業株式会社 灯器の発光部分

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092852U (ja) * 1983-11-30 1985-06-25 白光電器工業株式会社 灯器の発光部分

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0386506U (en]) * 1989-12-20 1991-09-02
US7344296B2 (en) 2003-02-07 2008-03-18 Matsushita Electric Industrial Co., Ltd. Socket for led light source and lighting system using the socket
JP2005114924A (ja) * 2003-10-06 2005-04-28 Pentax Corp 撮影用照明装置
WO2007099796A1 (ja) * 2006-02-22 2007-09-07 Nippon Sheet Glass Company, Limited. 発光ユニット、照明装置及び画像読取装置
JPWO2007099796A1 (ja) * 2006-02-22 2009-07-16 日本板硝子株式会社 発光ユニット、照明装置及び画像読取装置

Also Published As

Publication number Publication date
JPH0544761B2 (en]) 1993-07-07

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